Archive/Recrystallization Microstructure and Texture Evolution of High-Purity Cu-Al Alloy Under Clock Rolling
Recrystallization Microstructure and Texture Evolution of High-Purity Cu-Al Alloy Under Clock Rolling
Mingxiang Liu, Shizheng Li, Bei Cai et al.
31 juillet 2026
en

Abstract

The grain size and texture of high-purity Cu-Al alloy are crucial for its application in sputtering targets. In order to improve the grain size and texture of high-purity Cu-Al alloy, clock rolling followed by a subsequent annealing process was employed in the study. In comparison with unidirectional rolling (UR), the grain structure and texture evolution during clock rolling and annealing were characterized and analyzed. The results show that clock rolling (CR) promotes the uniform distribution of strain, and produces a dominant Cube texture after rolling. Experiments have confirmed that CR is more conducive to the occurrence of recrystallization than UR. After recrystallization, a large amount of the S texture is present in the specimens of UR, while S texture is obviously weakened in the specimens of CR. In addition, Cube texture transforms to S and Copper textures during recrystallization in CR specimens. Overall, clock rolling helps to generate equiaxed grains and weaken the texture.

Keywords

recrystallizationmicrostructuretextureevolutionhigh-puritycu-alalloyclockrollingcrystalsgrainsizecrucialapplicationsputteringtargetsorderimprovefollowedsubsequentannealingprocessemployedcomparison
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