Abstract

In-mold electronics (IMEs) present a highly promising monolithic integration strategy for manufacturing miniaturized 3D MEMS optical tweezers, offering exceptional environmental adaptability and structural compactness. However, the precision of such optical systems is heavily constrained by the injection molding process. During the molding phase, high-pressure melt scouring and severe thermo-mechanical coupling frequently induce geometric misalignment, manifesting as node displacement, localized warpage, and residual stress accumulation in the embedded circuits. This displacement critically alters the cross-sectional area of conductive traces, leading to resistance fluctuations that can destabilize the driving current. According to American Wire Gauge (AWG) standards, ensuring the geometric fidelity of this sensor-CPU interconnect pathway is fundamental to maintaining signal integrity. To address these manufacturing bottlenecks, this study systematically investigates the process stability of IME circuits Cyclic Olefin Copolymer (COC) is strategically selected as the substrate material over Polycarbonate (PC) and Liquid Silicone Rubber (LSR) due to its ultra-high light transmittance, extremely low water absorption, and superior thermomechanical stability. Based on finite element simulation, a data-driven intelligent optimization framework is developed. Latin Hypercube Sampling (LHS) is first utilized to efficiently sample the multi-dimensional process space, comprising melt temperature, packing pressure, and packing time. To handle the non-stationary nature of process feedback signals, wavelet analysis is introduced to decouple high-frequency noise, extracting Wavelet Energy Entropy (WEE) as a highly robust dynamic metric for process stability. Subsequently, a hybrid NSGA-II-MOPSO multi-objective algorithm is deployed to cooperatively optimize the injection parameters. The simulation-based optimization results demonstrate a substantial enhancement in manufacturing precision. Under the optimal parameter configuration, the average node displacement of the embedded circuits decreases significantly from 0.034 mm to 0.014 mm, achieving a 58.82% reduction. Simultaneously, volumetric shrinkage drops from 5.755% to 4.832% (a 16.04% reduction), while residual stress is maintained well within the structural safety threshold of optical-grade polymers. By clarifying the deformation control mechanism during the manufacturing phase, this study provides a highly reliable, data-driven methodological framework for the precision mass production of micro-nano optical systems.

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